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The method and process of cover tape and carrier tape packaging of electronic components is a popular method of encapsulating electronic components, especially surface mount components. The process involves placing the component on carrier tape, which is a continuous strip…
Integrated Circuit (IC) packaging tubes are used for packaging electronic components, specifically IC chips, which are used in various electronic devices such as computers, smartphones, and other digital devices. The packaging tube serves as a protective enclosure for the IC…
PS transparent carrier tape sheet is becoming increasingly popular in the packaging and testing industry due to their versatility and ability to improve the overall efficiency of the process. These sheets offer high transparency and provide a secure method for…
Due to the rapid development of the semiconductor industry, the carrier tape reel refers to the carrier widely used in ic devices, resistors, inductors, capacitors, and wafer packaging after the chip packaging, the carrier tape is usually coiled on the…
Cover tape is an essential component in the packaging of electronic components such as surface mount devices (SMD) and integrated circuits (ICs). It is used to securely seal the components in their packaging and protect them from environmental factors such…
A carrier tape stripping test is a type of test used to evaluate the strength of the bond between the carrier tape and the components stored on it. The test involves applying a force to pull the components off the…
Anti-static for the carrier tape and electronic packaging is very important, anti-static measures to do good or bad directly affect the effect of the packaging of electronic components, to anti-static carrier tape, ic carrier tape said to add some moisture-absorbing…
The role of SMD carrier tape perforation! When you see SMD carrier tape, have you ever wondered why the SMD carrier tape is perforated? Here newwaysmart to tell you about it! SMD carrier tape hole punching is the purpose of…
Upstream companies in the semiconductor wafer industry chain provide midstream manufacturers with all the raw materials, equipment and circuit design needed for production, midstream companies are responsible for the processing and manufacturing of semiconductor wafers and packaging and testing, and…
The basis for determining the carrier injection molding is the precision of the injection molded products, i.e. the standard tolerance, form tolerance and appearance roughness of the products. To carry out precision injection molding there are many related conditions necessary,…
