SMT industry market status and development trend forecast analysis can be seen that the market outlook is very good

The SMT industry market can be seen in the customer demand is gradually increasing, and surface mount technology updates and technology development is getting better and better, regardless of the degree of precision, flexibility, and efficiency are doing very well.

SMT industry market status and development trend forecast analysis

Surface mounting technology ( Surface Mounting Technology, abbreviated as SMT ) refers to the surface mounting device ( also called chip components ) installed in the printed Circuit Board surface welding technology, the Technology makes electronic products light, thin, shorter, smaller, multifunctional, high reliability, low cost and a series of other advantages. After years of development, SMT technology has been quite mature and has been extensively used in computer, communication, consumer electronics, industrial automation, and other electronic manufacturing industries.

SMT industry market research results show a growing trend

According to market study results, the global SMT placement equipment market is projected to grow by USD 627.46 million during 2021-2025, and the market will grow at a CAGR of 6.04% by 2024. Based on an analysis of various regions and their contributions to the global market, Technavio estimates that China, the U.S., Germany, Japan, and the U.K. will remain the major markets for SMT placement equipment. By 2024, consumer electronics, automobile, and communication segments will be the major drivers of the market and are expected to have a significant impact on end users.

SMT industry market technology renewal

In terms of new technological evolutions and costs, the pressure has given rise to automation, smart and flexible manufacturing, assembly, logistics loading companies, and packaging and testing integrated systems MES.SMT equipment through technological advances to improve the level of automation in the electronics industry to achieve fewer people work, reduce labor costs to increase individual output, and maintain competitiveness, is the main theme of SMT manufacturing. High performance, ease of use, flexibility, and environmental protection is the main development of SMT equipment’s inevitable trends.

SMT industry market technology of high performance, ease of use, flexibility and environmental protection is the inevitable trend of the main development of SMT equipment

SMT industry market high precision, and flexibility

Industry competition intensified, the new market cycle is increasingly shortened, and more demanding environmental requirements; in line with the trend of lower cost, and more miniaturization, the electronic manufacturing equipment has put forward higher requirements. Electronic devices are developing in the direction of high precision, high speed and ease of use, more environmental protection, and more flexibility. SMD head function head to achieve arbitrary automatic switching; SMD head to achieve dispensing, printing, detection feedback, placement accuracy stability will be higher, parts and substrate window large compatible flexible ability will be stronger.

SMT industry market high-speed, miniaturized

Brought to achieve high efficiencies, low powers, occupy little space, and low cost. The demand for high-speed multifunctional bonders with bonder effectiveness and multifunctional double excellent is gradually increasing, and in the production mode of multiple bonders with multiple tracks, the production capacity can reach about 100000CPH.

SMT industry market semiconductor packaging and SMT integration trend

Electronic product volume is becoming smaller, the function is becoming more diversified, components are becoming more precise, and semiconductor packaging and surface mount technology integration has become a general trend. Semiconductor manufacturers have begun to apply high-speed surface mount technology, and surface mount production line also integrates some applications of semiconductor, the traditional technology area boundary is becoming blurred. The fusion development of technology also brings many products that have been recognized by the market. POP technology has been widely used on high-end intelligent products, most brand placement machine company provides flip chip equipment (direct application wafer feeder), that is, provides a good solution for the fusion of surface mount and semiconductor assembly.