Tape and Reel requirements for the packaging of SMD electronic components

In the general trend of miniaturization and low power consumption of smart terminals, surface mount (SMD) is the inevitable choice for most electronic components packaging. In order to adapt to automated machine production, both diode packages, triode packages, MOS tube packages, and semiconductor chip packages are packaged using Tape and Reel in accordance with ANSI/EIA 481-C.

Chip component packaging form and tape and reelsform

Chip component packaging is a fully automated process that requires investment in laser marking machines, automatic taping machines for SMD components, machine vision inspection equipment, and corresponding packaging materials such as carrier tape, cover tape, IC Tube，IC Tray， and tape reel. Some small manufacturers focus on the production of bulk components and outsource the packaging process to professional manufacturers, which gives rise to the SMD component packaging OEM business.

There are 10 types of OEM forms of SMD components packaging as follows

(1) DFN series, DF-S, D2PAK, D-PAK.

(2) MELF, MiniDIP, MiniMELF.

(3) MSOP-8L, MSOP-10L.

(4) PowerDI 5, PowerDI 123/PowerMite 3.

(5) SC-59.

(6) SMA, SMB, SMC.

(7) SOD-123/323/523.

(8) son-6l, sop-8l, sop-14l, sop-16l.

(9) SOT-23/323/353/363/523, SOT-23/-26/SC-74R/SOT-563, SOT89-3, SOT89-5L, SOT-143, SOT-223, SOT-553.

(10) TO-252-3L/TO-252-5L, TO-263-3L/TO-263-5L, TSSOP-14L.

In the process of SMD components packaging, we need to pay attention to the important matters are: carrier tape and reel size and positioning, carrier tape and reel material and material, carrier tape and reel packaging restrictions, etc.

Embossed carrier tape (EMBOSSED CARRIER TAPE) specifications

For carrier tape, the current mainstream choice is embossed carrier tape, and the sizes of carrier tape are 8mm, 12mm, 16mm, and 24mm.

Among them

(1) 8mm carrier tape is used for DFN series, SOT-23, SOT-25, SOT-26, SOT-143, SOT-323, SOT53, MiniMELF, PowerDI 123, PowerDI 323, SOD-123, SOD-323, SOD-523, SC-59, SC-74R package component devices.

(2) 12mm carrier tape for DFN series for MELF, SMA, SMB, miniDIP, SOP-8L, SOT-223, SOT-89 package components.

(3) 16mm carrier tape is used for DFN series for SOP-14L, SOP-16L, SMC, DFS, PowerDI 5, TO-252 package components.

(4) 24mm carrier tape for D2PAK, TO-263 package components.

Packaging tape and reel (CARRIER TAPE & REEL) specifications

CARRIER TAPE & REEL are manufactured according to EIA-481-C standard. When loading the machine, pay attention to the size of the space part of the tape, i.e. Tape Leader and Tape Trailer. Among them, the conductive carrier tape (Tape Leader) should be above 230mm, and the size of the tail tape (Tape Trailer) is 160mm minimum.

SMT is a form of packaging for semiconductor devices, SMT involves a wide variety of parts, different styles, many have formed a common industry standard, which is mainly some chips capacitors resistors and so on. The packaging form is the most widely used, the application time is the longest, the adaptability is strong, the placement efficiency is high one kind of packaging form, has standardized.